Download Advanced Flip Chip Packaging by Robert Lanzone (auth.), Ho-Ming Tong, Yi-Shao Lai, C.P. Wong PDF

By Robert Lanzone (auth.), Ho-Ming Tong, Yi-Shao Lai, C.P. Wong (eds.)

Advanced turn Chip Packaging provides prior, current and destiny advances and traits in parts akin to substrate know-how, fabric improvement, and meeting techniques. turn chip packaging is now in frequent use in computing, communications, buyer and car electronics, and the call for for turn chip know-how is continuous to develop as a way to meet the necessity for items that provide greater functionality, are smaller, and are environmentally sustainable.

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Extra resources for Advanced Flip Chip Packaging

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17 SIP Concept; an Schematic SIP Package containing Chips, RFIC, passives (L, R, C), and memory [30] for storing information, and I/O circuits for information exchange with the outside world. In a SIP all of these individual chips together with other devices like passives, filters, antennas are assembled into a single package using wirebond or/and, solder interconnect technologies, resulting into tremendous space savings and significant down-sizing of handheld wireless applications. SIP is different from SoC or “System-on-a-Chip,” which is a complete electronic system built on a single chip.

This process has evolved to finer and finer pitch utilizing a variety of solder deposition methods. 2 depicts the various elements for the traditional first level packages. The first level package function is to redistribute the wiring to the printed wiring board (PWB) pitch while maintaining electrical signal integrity, and to provide a cooling platform for high-end ASICs applications. Flip chips were E. com K. -M. Tong et al. 1007/978-1-4419-5768-9_2, # Springer Science+Business Media New York 2013 23 24 E.

Specialization” of test capability requires some standardized vital elements: for example an industrystandard bus structure, compatibility with industry-standard data formats, browser technology to access and control resources, a modular hardware and software 44 E. Perfecto and K. Srivastava structure to enable re-configurability, and partitioned test supported by ATE and EDA tools. SIP design allows manufacturers to bring together many IC, package assembly, and test technologies to create highly integrated products with optimized cost, size, and performance.

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